Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing, and encapsulating applications where thermal conductivity and electrical insulation are required. With a high thermal conductivity value of 8-11 BTU•in/(ft2 •hr•°F) [1.16-1.60 W/(m•K)], it is formulated with a small particle size filler, making it ideal for filling small cavities and applying the product in thin sections. Its volume resistivity is greater than 1015 ohm-cm.
“EP40TC’s key distinguishing factor is that there is no compromise on the bond strength while providing excellent elongation and toughness. It has a high strength profile with a tensile lap shear strength of 2,300-2,500psi, an elongation of 60%-70%, and a tensile modulus of 5,000-15,000psi,” says senior product engineer Rohit Ramnath. “Also, it meets NASA low outgassing specifications, which is a prerequisite for many aerospace, electronic, and optical applications.”
Serviceable from -100°F to +300°F, this toughened system resists thermal cycling, vibration, and shock. EP40TC exhibits a high peel strength of 40-60pli and a Shore D hardness of 70-80 at 75°F. It features a convenient 1:1 mix ratio, and cures in two to three days at room temperature, or faster with the addition of heat. This compound adheres well to a variety of substrates such as metals, composites, glass, and many plastics. EP40TC is available in standard packaging, as well as premixed and frozen syringes.
For more information, please visit our product page.