Designed for use in MicroTCA applications, the new compact cooling package (CCP) from Rittal has the flexibility and scalability to provide targeted cooling in many rack mounted applications where significant amounts of heat are being generated. Each CCP is capable of removing up to 1200W of heat in an efficient, controlled manner and multiple systems may be distributed within the rack if required.
The 482.6mm (19in) rack mountable CCP comprises a controller managed air/water heat exchanger, 300mm deep, and a 482.6mm fan tray, which can be supplied as a fully wired and piped re-cooling system. Both major components of the CCP are just 1U in height and may be separated by the electronics they are cooling.
Supporting all leading IPMI and Rittal CMC-TC (computer-multi-control top-concept) protocols, the CCP can be controlled via a CPU. If a fan breaks down or in the event of extreme air temperatures (96h at 55°C), the system still remains operational. The use of robust controllers and sensors ensures secure cooling and allows the system to be reliably controlled automatically.
Modular and easy to install, the system can be matched to specific, actual cooling needs due to its flexibility. Applications with ambient temperatures of up to 55°C and at 1,800m above sea level are therefore possible.
With the increasing compactness of electronic systems, and MicroTCA systems, power losses of 600 watts and more can be expected per shelf. One Rittal CCP unit will effectively cool two MicroTCA shelves, providing efficient dispersal of heat, and keeping the electronic systems at constant low temperatures by monitoring the internal temperature.
Any vertically cooled rackmount electronic systems can benefit from this development, which has the added advantage that systems placed nearer the top of the rack can receive cooling air at the same temperature as those lower down.