European Patent Granted to MTM Power’s Thermoselective Vacuum Encapsulation

After many years of research, MTM Power® has developed an encapsulation technology which is unique in the world: the thermoselective vacuum encapsulation.

Due to the extreme hard cover, which is the result of the thermoselective vacuum encapsulation, they are absolutely robust and resistant. Thus, MTM Power modules are completely resistant against shock and vibration as well as dust and humidity. The modules are insensitive to mechanical stress and are free of air inclusions. The efficient heat dissipation of power semiconductor devices extends their service life. The special encapsulation material is self-extinguishing according to UL94-V0 and meets IP67.

Recently, an EP1987708 patent has been granted to MTM Power’s vacuum encapsulation technology and furthermore, the vacuum-encapsulated modules of the series PM-IP67A are patented in the United States, under US Patent 8,263,880.

For more information, please contact MTM Power.