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18 January 2011

Master Bond Presents the New Supreme 33

Formulated for structural applications in extreme environments with temperatures from -80°F to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond strength to a wide variety of substrates including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. Supreme 33 also resists chemicals including water, oil and many organic solvents.

Supreme 33 has a mix ratio of 100 to 70 by weight or one to one by volume. It cures conveniently at room temperature in 48hr – 72hr. For optimal performance, the suggested schedule is curing overnight at room temperature followed by 2hr – 3hr at +150°F to +200°F. This 100% reactive epoxy does not contain any solvents or diluents, has exceptional dimensional stability and features very low shrinkage upon cure.

It produces high-performance bonds boasting a shear strength over 2,500psi, a tensile shear strength greater than 7,500psi and a T-peel strength exceeding 15pli. With a volume resistivity of 1,014ohms-cm, a dielectric strength over 400V/ml, and a dielectric constant of 3.8 at 75°F, Supreme 33 is an outstanding electrical insulator that is widely used in the electronic, electrical, aerospace and OEM industries. Supreme 33 is also available in a non-drip version called Supreme 33ND.

Master Bond Supreme 33 combines exceptional durability and toughness for high-temperature resistance bonding and sealing applications.

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