After many years of research, MTM Power has developed and patented an encapsulation technology which is unique in the world: the thermoselective vacuum encapsulation. Thus, MTM Power modules are completely resistant against shock and vibration as well as dust and humidity. Due to the extremely hard cover – the result of the thermoselective vacuum encapsulation – they are absolutely robust, resistant and safe under extreme conditions. They are insensitive to mechanical stress and free of air inclusions. The efficient heat dissipation of power semiconductor devices extends the service’s life time. These special encapsulation materials are self-extinguishing acc. to UL94-V0 and meet IP67.
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